Author name: Rohit Shukla

HIS grace turns a speck of sand on a beach into a chip of sparkling gold. -Tandon Sir PART-IV 3nm is a next-generation manufacturing technique, this enhanced process will play an important role in next-generation chips. The “node” of the process is, in simple terms, a measure of the smallest possible dimension used in manufacturing,

HIS grace turns a speck of sand on a beach into a chip of sparkling gold. -Tandon Sir PART-III Semiconductor device fabrication is the process used to manufacture semiconductor devices, typically integrated circuits (ICs) such as computer processors, microcontrollers, and memory chips (such as NAND flash and DRAM) that are present in everyday electrical and

HIS grace turns a speck of sand on a beach into a chip of sparkling gold. -Tandon Sir PART-II An integrated circuit is an monolithic circuit. It is a microscopic array of electronic circuits and electronic components (resistors, capacitors, inductors…) that are diffused or implanted into the surface of semiconductor material wafer such as silicon. 

HIS grace turns a speck of sand on a beach into a chip of sparkling gold. -Tandon Sir PART-I An electronic circuit is composed of individual electronic components, such as resistors, transistors, capacitors, inductors and diodes, connected by conductive wires or traces through which electric current can flow. Broadly speaking an electronic circuit has both